Display device and inter-substrate conducting structure

ABSTRACT

According to one embodiment, a display device includes a first substrate including a first base member and a first terminal, a second substrate including a second base member including a first surface opposing the first terminal and a second surface on an opposite side to the first surface, a second terminal located on a side of the second surface, and a first hole, an organic insulating layer located between the first terminal and the second base member and including a second hole connecting to the first hole and a connecting material provided on the first hole to electrically connect the first terminal and the second terminal to each other, at least one of the first terminal and the second terminal including an oxide electrode in contact with the connecting material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2017-012121, filed Jan. 26, 2017, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device and aninter-substrate conducting structure.

BACKGROUND

In recent years, various techniques for reducing the width of the framein display devices are being studied. One example discloses a techniqueof utilizing another connector (inter-substrate connector) whichelectrically connects a wiring portion comprising a contact-holeconnecting material inside a hole which penetrates an inner surface andan outer surface of a resin-made first substrate, and a wiring portionprovided on an inner surface of a resin-made second substrate to eachother.

SUMMARY

The present application generally relates to a display device and aninter-substrate conducting structure.

According to one embodiment, a display device includes a first substrateincluding a first base member and a first terminal, a second substrateincluding a second base member including a first surface opposing thefirst terminal and a second surface on an opposite side to the firstsurface, a second terminal located on a side of the second surface, anda first hole, an organic insulating layer located between the firstterminal and the second base member and including a second holeconnecting to the first hole and a connecting material provided on thefirst hole to electrically connect the first terminal and the secondterminal to each other, at least one of the first terminal and thesecond terminal including an oxide electrode in contact with theconnecting material.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a configuration example of adisplay device of an embodiment.

FIG. 2 is a cross-sectional view showing an example of a secondsubstrate shown in FIG. 1.

FIG. 3 is a cross-sectional view showing an example of the secondsubstrate shown in FIG. 1.

FIG. 4 is a cross-sectional view showing an example of s secondsubstrate shown in FIG. 1.

FIG. 5 is the cross-sectional view showing an example of s secondsubstrate shown in FIG. 1.

FIG. 6 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 7 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 8 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 9 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 10 is a cross sectional view showing an example of the displaydevice DSP shown in FIG. 1.

FIG. 11 is a plan view showing a configuration example of the displaydevice of the embodiment.

FIG. 12 is a diagram showing a basic structure and an equivalent circuitof a display panel shown in FIG. 11.

FIG. 13 is a cross-sectional view showing the structure of a part of thedisplay panel shown in FIG. 11.

FIG. 14 is a plan view showing a configuration example of a sensor.

FIG. 15 is a cross section of the display panel taken along a line A-Bshown in FIG. 11, which includes a contact hole.

FIG. 16 is a diagram showing a processing step in an example of a methodof manufacturing a display device of the embodiment.

FIG. 17 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 18 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 19 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 20 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 21 is a diagram showing a processing step in another example of themethod of manufacturing the display device of the embodiment.

FIG. 22 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 23 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

FIG. 24 is a diagram showing a processing step in the example of themethod of manufacturing the display device of the embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a display device is provided,which comprises a first substrate comprising a first base member and afirst terminal, a second substrate comprising a second base membercomprising a first surface opposing and spaced apart from the firstterminal and a second surface on an opposite side to the first surface,a second terminal located on a side of the second surface, and a firsthole which penetrates from the first surface to the second surface, anorganic insulating layer located between the first terminal and thesecond base member and comprising a second hole connecting to the firsthole and a connecting material provided on the first hole toelectrically connect the first terminal and the second terminal to eachother, at least one of the first terminal and the second terminalincluding an oxide electrode in contact with the connecting material.

According to another embodiment, a display device is provided, whichcomprises a first substrate comprising a first base member, a firstterminal and a first interlayer insulating layer located between thefirst base member and the first terminal, a second substrate comprisinga second base member comprising a first surface opposing and spacedapart from the first terminal and a second surface on an opposite sideto the first surface, a second terminal located on a side of the secondsurface, and a first hole which penetrates from the first surface to thesecond surface, an organic insulating layer located between the firstterminal and the second base member and comprising a second holeconnecting to the first hole and a connecting material provided on thefirst hole to electrically connect the first terminal and the secondterminal to each other, the first terminal comprising a first oxideelectrode located on the first interlayer insulating layer, a secondoxide electrode located above the first oxide electrode, and a secondinterlayer insulating layer located between the first oxide electrodeand the second oxide electrode, the second terminal comprising a metallayer in contact with the second surface and a third oxide electrode incontact with the metal layer, and the first oxide electrode, the secondoxide electrode, and the third oxide electrode are in contact with theconnecting material.

According to another embodiment, an inter-substrate conducting structureis provided, which comprises a first substrate comprising a first basemember and a first terminal, a second substrate comprising a second basemember comprising a first surface opposing and spaced apart from thefirst terminal and a second surface on an opposite side to the firstsurface, a second terminal located on a side of the second surface, anda first hole which penetrates from the first surface to the secondsurface, an organic insulating layer located between the first terminaland the second base member and comprising a second hole connecting tothe first hole and a connecting material provided on the first hole toelectrically connect the first terminal and the second terminal to eachother, at least one of the first terminal and the second terminalincluding an oxide electrode in contact with the connecting material.

Embodiments will now be described with reference to accompanyingdrawings. Note that the disclosure is presented for the sake ofexemplification, and any modification and variation conceived within thescope and spirit of the invention by a person having ordinary skill inthe art are naturally encompassed in the scope of invention of thepresent application. Further, a width, thickness, shape, and the like ofeach element are depicted schematically in the figures as compared toactual embodiments for the sake of simpler explanation, and they do notlimit the interpretation of the invention of the present application.Furthermore, in the description and figures of the present application,structural elements having the same or similar functions will bereferred to by the same reference numbers and detailed explanations ofthem that are considered redundant may be omitted.

In the embodiment, a display device will be disclosed as an example ofthe electronic device. The display device can be used in, for example,various types of equipment such as smartphones, tablet terminals, mobiletelephone terminals, notebook personal computers, and game consoles. Themajor configuration explained in the present embodiment can also beapplied to a liquid crystal device, a self-luminous display devicecomprising an organic electroluminescent display element, and the like,an electronic paper display device comprising an electrophoreticelement, and the like, a display device employingmicro-electromechanical systems (MEMS), or a display device employingelectrochromism.

FIG. 1 is a cross sectional view showing a configuration example of adisplay device DSP of this embodiment. A first direction X, a seconddirection Y, and a third direction Z are orthogonal to each other, butthey may cross at an angle other than 90 degrees. The first direction Xand the second direction Y are parallel to a surface of a substrate ofthe display device DSP, and the third direction Z is a thicknessdirection of the display device DSP. Here, FIG. 1 shows a crosssectional view of a part of the display device DSP in an X-Y planedefined by the first direction X and the second direction Y.

The display device DSP comprises a first substrate SUB1, a secondsubstrate SUB2, an organic insulating layer OI, a liquid crystal layerLC, a wiring substrate SUB3, a connecting material C, and a filingmaterial FI. The first substrate SUB1 and the second substrate SUB2oppose the third direction Z. In the following descriptions, thedirection from the first substrate SUB1 towards the second substrateSUB2 is defined as above (or simply up), and the direction from thesecond substrate SUB2 towards the first substrate SUB1 is defined asbelow (or simply down). Viewing from the second substrate SUB2 towardsthe first substrate SUB1 is defined as planar view.

The first substrate SUB1 comprises a first base member 10, a firstterminal TM1, a wiring line WR, and a pad electrode PD. The first basemember 10 comprises a surface 10A opposing the second substrate SUB2 andanother surface 10B on an opposite side to the surface 10A. In theexample illustrated, the first terminal TM1, wiring line WR, and padelectrode PD are located on a surface 10A side. The wiring line WR isdisposed between the first terminal TM1 and the pad electrode PD. Thefirst terminal TM1 and the pad electrode PD are electrically connectedto each other via the wiring line WR. Although not illustrated in thefigure, various types of insulating layers and conducting layers may bedisposed between the first base member 10 and a group of the firstterminal TM1, wiring line WR and pad electrode PD, and on the firstterminal TM1, the wiring line WR and the pad electrode PD. Further, thefirst terminal TM1, the wiring line WR, and the pad electrode PD may beformed in layers separate from each other via an insulating layer or thelike. Note that the first base member 10 corresponds to a firstinsulating substrate, and the second base member 20 corresponds to asecond insulating substrate. As the first insulating substrate andsecond insulating substrate, resin substrates can be adopted.

The second substrate SUB2 comprises a second base member 20, a secondterminal TM2, a detection electrode Rx and a protection material PT. Thesecond base member 20 comprises a surface 20A opposing the firstsubstrate SUB1 and another surface 20B on an opposite side to thesurface 20A. The surface 20A opposes the first terminal TM1 and isspaced apart from the first terminal TM1 along the third direction Z.The first base member 10 and the second base member 20 are formed from,for example, no-alkali glass. In the example illustrated, the secondterminal TM2 and the detection electrode Rx are located on a surface 20Bside. The second terminal TM2 and the detection electrode Rx areelectrically connected to each other. The protection material PT isdisposed on the detection electrode Rx. The protection material PT maybe disposed on the second terminal TM2 as well. Although notillustrated, various types of insulating layers and conducting layersmay be provided between the second base member 20 and a group of thesecond terminal TM2 and detection electrode Rx.

The organic insulating layer OI is located between the first terminalTM1 and the second base member 20. In the example illustrated, theorganic insulating film OI is in contact also with the first base member10 and the wiring line WR. Here, the organic insulating layer OIincludes, for example, a light-shielding layer, a color filter, anovercoat layer, and an alignment film, which will be described later,and also a sealing material which attaches the first substrate SUB1 andthe second substrate SUB2 to each other. The liquid crystal layer LC islocated in the region surrounded by the first substrate SUB1, the secondsubstrate SUB2 and the sealing material SE.

A wiring substrate SUB3 is mounted on the first substrate SUB1 so as tobe electrically connected to the pad electrode PD. The wiring substrateSUB3 having such configuration is, for example, a flexible substratewith flexibility. Note that a flexible substrate applicable to thisembodiment should only comprise at least partially a flexible portion ofa bendable material. For example, the wiring substrate SUB3 of thisembodiment each may be a flexible substrate in its entirety, or may be arigid flexible substrate comprising a rigid portion formed of a rigidmaterial such as glass epoxy and a flexible portion formed of a bendablematerial such as polyimide.

Here, a connection structure between the first terminal TM1 and thesecond terminal TM2 in this embodiment will be described in detail.

In the second substrate SUB2, the second base member 20 comprises a hole(first hole) VA which penetrates between the surface 20A and the surface20B. In the example illustrated, the hole VA penetrates the secondterminal TM2 as well.

Between the first substrate SUB1 and the second substrate SUB2, theorganic insulating film OI comprises a hole (second hole) VBcommunicated to the hole VA.

On the other hand, in the first substrate SUB1, the first terminal areaTM1 comprises a hole VC connected to the hole VB. Further, the firstglass substrate 10 comprises a concavity CC opposing the hole VC alongthe third direction Z. The concavity CC 1 is formed from the surface 10Atoward the surface 10B, but in the example illustrated, it does notpenetrate to the surface 10B. For example, the depth of the concavity CCalong the third direction Z is about ⅕ to ½ of the thickness of thefirst base member 10 along the third direction Z. Note that the firstbase member 10 may comprise a hole which penetrates between the surface10A and the surfaces 10B in place of the concavity CC. Each of the holeVC and the concavity CC is located directly under the hole VA. The holesVA, VB, VC and the concavity CC are located in the same straight linealong the third direction Z, and form the contact hole V.

In the example illustrated, the hole VB is expanded in the seconddirection Y as compared to the holes VA and VC. The hole portion VB isexpanded not only in the second direction Y but also in all directionsin the X-Y plane further than the holes VA and VC.

The connecting material C is provided through the holes VA and VB toelectrically connect the first terminal TM1 and the second terminal TM2to each other. More specifically, the connecting material C is formed oninner surfaces of the holes VA, VB, VC and the concavity CC. In theexample illustrated, the connecting material C are formed withoutinterruption in through the holes VA, VB, VC and the concavity CC. Theconnecting material C should preferably contain a metal material such assilver and fine particles having a diameter of the order of from severalnanometers to tens of nanometers, with which the metal material ismixed. Note that the solvent of the connecting material C evaporates inthe manufacturing process, and therefore the connecting material Cattaching to the wall surface of the contact hole V may be a thin filmof a metal material.

In the example illustrated, the connecting material C is in contact witheach of an upper surface LT2 and inner surfaces LS2 of the secondterminal TM2 and an inner surface 20S of the second base member 20. Theinner surfaces LS2 and 20S form the inner surface of the hole VA. Theconnecting material C is in contact with an inner surface OIS of theorganic insulating layer OI. The inner surface OIS forms an innersurface of the hole VB. Further, the connecting material C is also incontact with each of the inner surface LS1 of the first terminal TM1 andthe concavity CC 1. The inner surface LS1 forms the inner surface of thehole VC.

In the example illustrated, the connecting material C is provided on theinner surfaces of the holes VA, VB, VC and the concavity CC, but it mayfill up the holes VA, VB, VC and the concavity CC to be buried. In thiscase as well, the connecting material C is formed continuously withoutinterruption between the first terminal TM1 and the second terminal TM2.

A hollow section of the contact hole V is filled with a filling materialFI. Further, the filling material FI is disposed above the secondterminal TM2 as well to cover the connecting material C and the secondterminal TM2. The filling material FI has, for example, insulatingproperties, and is formed from an organic insulating material. Thus,with the filling material FI, a level difference along the thirddirection Z resulting from the hollow portion formed in the contact holeV can be reduced. Further, the connecting material C can be protected.Moreover, the filling material FI may have conductivity and, forexample, may be a material obtained by hardening a paste containingconductive particles such as of silver. In the case where the fillingmaterial FI has conductivity, even if the connecting material C isbroken off, the filling material FI can electrically connect the firstterminal TM1 and the second terminal TM2 to each other, thereby makingit possible to improve the reliability.

With the above-described structure, the second terminal TM2 iselectrically connected to the wiring substrate SUB3 via the connectingmaterial C, the first terminal TM1 and the like. Thus, control circuitsfor writing signals to the detection electrode Rx or reading signalsoutput therefrom are electrically connected to the detection electrodeRx via the wiring substrate SUB3. In other words, in order to connectthe detection electrode Rx and the control circuits to each other, it isno longer necessary to provide a wiring substrate SUB4, indicated bydotted line in FIG. 1, in the second substrate SUB2.

Further, in this embodiment, at least one of the first terminal TM1 andthe second terminal TM2 includes an oxide electrode in contact with theconnecting material C. For example, the first terminal TM1 may be formedentirely from an oxide electrode, or may include an oxide electrode onan inner surface LS1 side, which is in contact with the connectingmaterial C, which will be described later. Here, for example, the secondterminal TM2 may be formed entirely from a metal material or the like,or may include an oxide electrode. Moreover, for example, the secondterminal TM2 may be formed entirely from an oxide electrode or mayinclude an oxide electrode on an inner surface LS2 side, which is incontact with the connecting material C. Here, for example, the firstterminal TM1 may be formed entirely from a metal material or the like ormay include an oxide electrode. Moreover, the first terminal TM1 and thesecond terminal TM2 may be of a multilayer structure, and in this case,the top layer may be formed from an oxide electrode, which will bedescribed later.

Note that when the first terminal TM1 and the second terminal TM2include an oxide electrode, the parts other than the oxide electrode inthe first terminal TM1 and the second terminal TM2 are formed of, forexample, a metal material or the like.

In the example illustrated, the first terminal TM1 and the secondterminal TM2 are oxide electrodes formed from, for example, atransparent conductive material such as indium tin oxide (ITO), indiumgallium oxide (IGO) or indium zinc oxide (IZO).

According to this embodiment, at least one of the first terminal TM1 andsecond terminal TM2 includes an oxide electrode in contact with theconnecting material C. With this structure, as compared to the casewhere the first terminal TM1 and the second terminal TM2 are formed froma metal material, it is possible to prevent the first terminal TM1 andthe second terminal TM2 from being oxidized. Thus, it is possible tosuppress the resistance of the first terminal TM1 and the secondterminal TM2 from increasing with time.

Further, as compared to the example in which a wiring substrate SUB4 ismounted in the second substrate SUB2 in addition to the wiring substrateSUB3 mounted in the first substrate SUB1, this embodiment no longerrequires the terminal for mounting the wiring substrate SUB4 or therouting line for connecting the second terminal TM2 and the wiringsubstrate SUB4 to each other. Therefore, the size of the secondsubstrate SUB2 in the X-Y plane defined by the first direction X and thesecond direction Y can be reduced, and also the width of the frame inthe peripheral portion of the display device DSP can be decreased.Further, the cost for the wiring substrate SUB4, which is no longernecessary, can be reduced. Thus, the width of the frame can be reducedand a low-cost can be achieved.

FIG. 2 is a cross-sectional view showing an example of second substrateSUB2 shown in FIG. 1.

As will be described later, the display device DSP comprises a displayarea DA which displays images and a non-display area NDA surrounding thedisplay area DA. In the example illustrated, the detection electrode Rxis located in the display area DA. The second terminal TM2 and thecontact hole V are located in the non-display area NDA.

The second terminal TM2 comprises a metal layer MT in contact with thesurface 20B and an oxide electrode OX disposed on the metal layer MT.The metal layer MT may be formed from, for example, a metal materialcontaining molybdenum or aluminum, or an alloy in combination of these,and may be of a single- or multi-layer structure. Further, the metallayer MT may be formed in and by the same process and the same materialas those of the detection electrode Rx. The oxide electrode OX is incontact with the metal layer MT. Furthermore, the oxide electrode OX isin contact with the connecting material C on the inner surface LS2. Theprotection component PT is formed continuously in from the display areaDA to the non-display area NDA. The protection component PT is disposedon the detection electrode Rx in the display area DA, and on the secondterminal TM2 in the non-display area NDA. That is, the protectioncomponent PT is in contact with the oxide electrode OX.

With this structure, the advantages described above can be obtained.

FIG. 3 is a cross-sectional view showing an example of the secondsubstrate SUB2 shown in FIG. 1.

The structure shown in FIG. 3 is different from that of FIG. 2 in thatthe protection component PT is not disposed on the second terminal TM2in the non-display area NDA. In this case as well, since the secondterminal TM2 comprises an oxide electrode OX which covers the metallayer MT, it is possible to suppress the second terminal TM2 from beingoxidized.

With this structure, the advantages described above can be obtained.

FIG. 4 is a cross-sectional view showing another example of the secondsubstrate SUB2 shown in FIG. 1.

The structure shown in FIG. 4 is different from that of FIG. 2 in thatthe entire second terminal TM2 is the oxide electrode OX. The oxideelectrode OX is in contact with the surface 20B. Here, the secondterminal TM2 has a thickness W1 along the third direction Z, and thedetection electrode Rx has a thickness W2 along the third direction Z.The thickness W1 is greater than the thickness W2. For example, thethickness W1 is substantially equal to the thickness of the secondterminal TM2 shown in FIG. 2 along the third direction Z.

With this structure, the advantages described above can be obtained.

FIG. 5 is a cross-sectional view showing an example of the secondsubstrate SUB2 shown in FIG. 1.

The structure shown in FIG. 5 is different from that of FIG. 4 in thatthe protection component PT is not disposed on the second terminal TM2in the non-display area NDA. In this case as well, since the secondterminal TM2 is the oxide electrode OX, and therefore its oxidizationcan be suppressed.

With this structure, the advantages described above can be obtained.

FIG. 6 is a cross-sectional view showing an example of the displaydevice DSP shown in FIG. 1. In the example illustrated, the displaydevice DSP comprises a first substrate SUB1, a second substrate SUB2 andsealing material SE.

In the example illustrated, the first substrate SUB1 comprises a firstbase member 10, a first interlayer insulating film IT1, a secondinterlayer insulating film IT2 and a first terminal TM1. The firstinterlayer insulating film IT1 is located between the first base member10 and the first terminal TM1. The first terminal TM1 comprises a firstoxide electrode OX1 located on the first interlayer insulating film IT1and a second oxide electrode OX2 located above the first oxide electrodeOX1. The first oxide electrode OX1 and the second oxide electrode OX2are in contact with the connecting material C. The second interlayerinsulating film IT2 is located between the first oxide electrode OX1 andthe second oxide electrode OX2.

The first interlayer insulating film IT1 is an organic insulating filmformed from, for example, an organic material and the second interlayerinsulating film IT2 is an inorganic insulating film formed from, forexample, an inorganic material. Further, the first oxide electrode OX1and the second oxide electrode OX2 are formed in and by the same processand the same material as those of, for example, the common electrode andthe pixel electrode, which will be described later. Here, the secondinterlayer insulating film IT2 is formed in and by the same process andthe same material as those of, for example, the interlayer insulatingfilm between the common electrode and the pixel electrode.

In the example illustrated, the second substrate SUB2 comprises a secondbase member 20, a light-shielding layer BM and an overcoat layer OC. Thelight-shielding layer BM is located on the surface 20A. The overcoatlayer OC covers the light-shielding layer BM.

The sealing material SE is provided between the first substrate SUB1 andthe second substrate SUB2 to attach the first substrate SUB1 and thesecond substrate SUB2 together. Here, the organic insulating film OIcorresponds to the light-shielding layer BM, the overcoat layer OC andthe sealing material SE. In the example illustrated, the contact hole Vpenetrates even to the first base member 10.

With this structure, the advantages described above can be obtained.

FIG. 7 is a cross-sectional view showing another example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 7 is differentfrom that of FIG. 6 in that the second interlayer insulating film IT2 isnot disposed between the first oxide electrode OX1 and the second oxideelectrode OX2. That is, the second oxide electrode OX2 is in contactwith the first oxide electrode OX1. That is to say, the first terminalTM1 may be formed by the oxide electrode of single layer.

With this structure, the advantages described above can be obtained.

FIG. 8 is a cross-sectional view showing another example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 8 is differentfrom that of FIG. 6 in that the first substrate SUB1 comprises metallicwiring lines MW1 and MW2 connected to the first terminal TM1.

The first oxide electrode OX1 and the second oxide electrode OX2 aredisposed around the contact hole V to be in contact with the connectingmaterial C. The metallic wiring line MW1 is disposed on the firstinterlayer insulating film IT1 and is electrically connected to thefirst oxide electrode OX1. Further, the metallic wiring MW2 is disposedon the second interlayer insulating film IT2 and is electricallyconnected to the second oxide electrode OX2. Note that ends of the firstoxide electrode OX1 and the second oxide electrode OX2 are located onends of the metallic wiring lines MW1 and MW2, respectively. That is,for example, the first oxide electrode OX1 and the second oxideelectrode OX2 are formed after the metallic wiring lines MW1 and MW2 areformed.

According to the structure shown in FIG. 8, the metallic wiring linesMW1 and MW2 formed from a metal having resistance lower than that of theoxide electrode are disposed around the first oxide electrode OX1 andthe second oxide electrode OX2. Thus, it is possible to lower theresistance of the layer in which the first oxide electrode OX1 and themetallic wiring line MW1 are provided, and also the resistance of thelayer in which the second oxide electrode OX2 and the metallic wiringline MW2 are provided, as compared to the structure shown in FIG. 6.

With this structure, the advantages described above can be obtained.

FIG. 9 is a cross-sectional view showing another example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 9 is differentfrom that of FIG. 7 in that the first substrate SUB1 comprises ametallic wiring line MW1 connected to the first terminal TM1.

The first terminal TM1 is disposed around the contact hole V so as to bein contact with the connecting material C. The metallic wiring line MW1is disposed on the first interlayer insulating film IT1 and iselectrically connected to the first terminal TM1. Thus, it is possibleto lower the resistance of the layer in which the first terminal TM1 andthe metallic wiring line MW1 are provided, as compared to the structureshown in FIG. 7.

With this structure, the advantages described above can be obtained.

FIG. 10 is a cross-sectional view showing another example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 10 is differentfrom that of FIG. 7 in that the contact hole V does not penetrate to thefirst base member 10, as compared with the structure shown in FIG. 7.

In the example illustrated, the contact hole V penetrates to the firstterminal TM1. The connecting material C is in contact with an uppersurface of the first terminal TM1.

With this structure, the advantageous described above can be obtained.

Note that the structures shown in FIGS. 6 to 10 may be combined with thestructure of any of those shown in FIGS. 2 to 5. Moreover, the oxideelectrode OX, the first oxide electrode OX1 and the second oxideelectrode OX2 may be subjected to a treatment such aspolycrystallization in order to lower the resistance.

FIG. 11 is a plan view showing a configuration example of the displaydevice DSP of this embodiment. Here, a plane of the display device DSPtaken along the X-Y plane defined by the first direction X and thesecond direction Y is shown.

The display device DSP comprises a display panel PNL, an IC chip I1, awiring substrate SUB3 and the like. The display panel PNL is a liquidcrystal display panel, and comprises a first substrate SUB1, a secondsubstrate SUB2, a sealing material SE and a display function layerequivalent to a liquid crystal layer. The second substrate SUB2 opposesthe first substrate SUB1. The sealing material SE corresponds to aportion hatched by lines upwardly slanting to the right in FIG. 1 andattaches the first substrate SUB1 and the second substrate SUB2together.

The display panel PNL comprises a display area DA which displays imagesand a frame-shaped non-display area NDA surrounding the display area DA.The sealing material SE is located in the non-display area NDA and thedisplay area DA is located in an inner side encircled by the sealingmaterial SE.

The wiring substrate SUB3 is mounted on the first substrate SUB1. The ICchip I1 is mounted on the wiring substrate SUB3. Note that thisconfiguration is not limited to the example illustrated, but the IC chipI1 may be mounted on the portion of the first substrate SUB1, whichextends out from the second substrate SUB2, or on an external circuitboard connected to the wiring substrate SUB3. The IC chip I1 includes,for example, a built-in display driver DD which outputs a signalrequired to display images. The display driver DD described herecontains at least a part of signal line drive circuits SD, scanning linedrive circuits GD and common electrode drive circuits CD, which will bedescribed later. In the example illustrated, the IC chip I1 contains abuilt-in detector RC which functions as a touch-panel controller or thelike. The detector RC may be built in an IC chip other than the IC chipI1.

The display panel PNL may be, for example, any one of a transmissivetype which displays images by selectively transmitting light from belowthe first substrate SUB1, a reflective type which displays images byselectively reflecting light from above the second substrate SUB2 and atrans-reflective type comprising a transmissive display function and areflective display function.

A sensor SS carries out sensing to detect contact or approaching of anobject with respect to the display device DSP. The sensor SS comprises aplurality of detection electrodes Rx (Rx1, Rx2, . . . ). The detectionelectrodes Rx are formed in the second substrate SUB2. These detectionelectrodes Rx each extend along the first direction X and arranged alongthe second direction Y to be spaced from each other.

FIG. 11 shows the detection electrodes Rx1 to Rx4 as the detectionelectrode Rx, and here its structure example will be described whilefocusing on the detection electrode Rx1. In FIG. 11, one end side isdefined as the region on the left-hand side to the display area DA, andthe other end side as the region on the right-hand side to the displayarea DA.

The detection electrode Rx1 comprises a detector RS and a connector CN.The detector RS is located in the display area DA and extends in thefirst direction X. In the detection electrode Rx1, the detector RS ismainly used for sensing. In the example illustrated, the detector RS isformed into a stripe shape, but more specifically, it is formed from anaggregate of fine metal thin wires as will be illustrated with referenceto FIG. 15. Further, one detection electrode Rx comprises two detectorsRS, but may comprise three or more detectors RS, or may comprise onlyone detector RS. The terminal RT is located on the other end side of thenon-display area NDA along the first direction X and connects aplurality of detectors RS to each other.

The detection electrode Rx1 is connected to the second terminal TM2. Thesecond terminal TM2 is formed in a position overlapping the sealingmaterial SE in plan view. The second terminal TM2 is located on one endside of the non-display area NDA along the first direction X and isconnected to the detector RS.

On the other hand, the first substrate SUB1 comprises a first terminalTM1 and a wiring line W1, electrically connected to the wiring substrateSUB3. The first terminal TM1 and the wiring line W1 are located in theone end side of the non-display area NDA and overlap the sealingmaterial SE in plan view. The first terminal TM1 is formed in a positionwhich overlaps the second terminal TM2 in plan view. The wiring line W1is connected to the first terminal TM1, extending along the seconddirection Y, and is electrically connected to the detector RC of the ICchip I1 via the wiring substrate SUB3.

The contact hole V1 is formed in a position where the second terminalTM2 and the first terminal TM1 oppose each other. The contact hole V1penetrates the second substrate SUB2 including the second terminal TM21and the sealing material SE. Further, the contact hole V1 may penetratethe first terminal TM11. As will be described later, the connectingmaterial C with conductivity is formed in the contact hole V1. Thus, thesecond terminal TM21 and the first terminal TM11 are electricallyconnected to each other. That is, the detection electrode Rx1 providedin the second substrate SUB2 is electrically connected to the detectorRC via the wiring board SUB3 connected to the first substrate SUB1. Thedetector RC reads a sensor signal output from the detection electrodeRx, and detects whether or not a detection object touches or approachesand the position coordinates of the detection object, etc.

In the example illustrated, the contact hole V1 is circular in planarview, but the shape thereof is not limited to that of the exampleillustrated, but may be some other shape such as elliptical.

In the example illustrated, the second terminal TM21, TM23, . . . ,first terminals TM11, TM13, . . . , wiring lines W1, W3, . . . andcontact holes V1, V3, . . . , connected to odd-numbered detectionelectrodes Rx1, Rx3, . . . , are each located in the one end side of thenon-display area NDA. Moreover, second terminal TM22, TM24, . . . ,first terminals TM12, TM14, . . . , wiring lines W2, W4, . . . , andcontact holes V2, V4, . . . , connected to even-numbered detectionelectrodes Rx2, Rx4, . . . , are each located in the other end side ofthe non-display area NDA. With such a layout, the one end side and theother end side of the non-display area NDA can be equalized in width,which is effective for the reduction of the width of the frame. Further,the wiring line W1 is connected to the detection electrode Rx via thefirst terminal TM1, and therefore when the wiring line W1 connected tothe detection electrode Rx is formed on a first substrate SUB1 side, theregion for forming the wiring line W1 in the second substrate SUB2 is nolonger necessary. Consequently, the region for arranging other memberscan be expanded, and further the degree of freedom in the layout of theshape of the second substrate SUB2 can be improved.

As illustrated, in the layout in which the first terminal TM13 is closerto the wiring board SUB3 than to the first terminal TM11, the wiringline W1 detour around an inner side (side close to the display area DA)of the first terminal TM13 and is arranged along an inner side of thewiring line W3 between the first terminal TM13 and the wiring boardSUB3. Similarly, the wiring line W2 detour around an inner side of thefirst terminal TM14, and is arranged along an inner side of the wiringline W4 between the first terminal TM14 and the wiring board SUB3.

FIG. 12 is a diagram showing a basic structure and an equivalent circuitof the display panel PNL shown in FIG. 11.

The display panel PNL comprises a plurality of pixels PX in the displayarea DA. Here, each pixel indicates a minimum unit individuallycontrollable according to a pixel signal, and exists in the regioncontaining a switching element provided at a position where a scanningline and a signal line cross each other, for example, which will bedescribed later. The pixels PX are arranged in a matrix along the firstdirection X and the second direction Y. Further, the display panel PNLcomprises a plurality of scanning lines G (G1 to Gn), a plurality ofsignal lines S (S1 to Sm), common electrodes CE, etc., in the displayarea DA. The scanning lines G each extend along the first direction Xand are arranged along the second direction Y. The signal lines S eachextend along the second direction Y and are arranged along the firstdirection X. The scanning lines G and the signal lines S are notnecessarily formed to extend linearly, but may be partially bent. Thecommon electrodes CE are each provided for a plurality of pixels PX. Thescanning lines G, the signal lines S and the common electrodes CE areall drawn out to the non-display area NDA. In the non-display area NDA,the scanning lines G are connected to the scanning line drive circuitGD, the signal lines S are connected to the signal line drive circuitSD, and the common electrodes CE are connected to the common electrodedrive circuit CD. The signal line drive circuit SD, the scanning linedrive circuit GD and the common electrode drive circuit CD may be formedon the first substrate SUB1 or partially or entirely built in the ICchip I1 shown in FIG. 11.

Each pixel PX comprises a switching element SW, a pixel electrode PE, acommon electrode CE, a liquid crystal layer LC, etc. The switchingelement SW is, for example, a thin film transistor (TFT) and iselectrically connected to a respective scanning line G and a respectivesignal line S. More specifically, the switching element PSW comprises agate electrode WG, a source electrode WS and a drain electrode WD. Thegate electrode WG is electrically connected to the scanning line G. Inthe example illustrated, the electrode electrically connected to thesignal line S is referred to as the source electrode WS, and theelectrode electrically connected to the pixel electrode PE is referredto as the drain electrode WD.

The scanning line G is connected to the switching element PSW in each ofthose pixels PX which are arranged along the first direction X. Thesignal line S is connected to the switching element PSW in each of thosepixels PX arranged along the second direction Y. Each of the pixelelectrodes PE opposes the respective common electrode CE and drives theliquid crystal layer LC with an electric field produced between thepixel electrode PE and the common electrode CE. A storage capacitor CSis formed, for example, between the common electrode CE and the pixelelectrode PE.

FIG. 13 is a cross section showing a part of structures of the displaypanel PNL shown in FIG. 11.

The display panel PNL illustrated here has a structure provided for thedisplay mode which mainly uses a lateral electric field substantiallyparallel to a surface of the substrate. The display panel PNL may have astructure provided for display mode using a vertical electric fieldperpendicular to the surface of the substrate, or an electric fieldoblique to the surface, or a combination thereof. To the display modeusing a lateral electric field, for example, such a structure isapplicable, that both of the pixel electrode PE and the common electrodeCE are provided one of the first substrate SUB1 and the second substrateSUB2. To the display mode using a vertical electric field or an obliqueelectric field, for example, such a structure is applicable, that one ofthe pixel electrode PE and the common electrode CE is provided on thefirst substrate SUB1, and the other one of the pixel electrode PE andthe common electrode CE is provided on the second substrate SUB2. Notethat the surface of the substrate here is that parallel to the X-Yplane.

The first substrate SUB1 comprises a first base member 10, signal linesS, a common electrode CE, metal layers M, a pixel electrode PE, a firstinsulating layer 11, a second insulating layer 12, a third insulatinglayer 13, a first alignment film AL1, etc. Note that the illustration ofthe switching element, scanning lines and various insulating layersinterposed between these, etc., is omitted.

The first insulating layer 11 is located on the surface 10A of the firstbase member 10. The signal lines S are located on the first insulatinglayer 11. The second insulating layer 12 is located on the signal linesS and the first insulating layer 11. The common electrode CE is locatedon the second insulating layer 12. The metal layers M are in contactwith the common electrode CE at positions directly above the signallines S, respectively. In the example illustrated, the metal layers Mare located on the common electrode CE, but may be located between thecommon electrode CE and the second insulating layer 12. The thirdinsulating layer 13 is located on the common electrode CE and the metallayers M. The pixel electrode PE is located on the third insulatinglayer 13. The pixel electrode PE opposes the common electrode CE via thethird insulating layer 13. The pixel electrode PE comprises a slit SL ina position opposing the common electrode CE. The first alignment filmAL1 covers the pixel electrode PE and the third insulating layer 13.

The structure of the first substrate SUB1 is not limited to the exampleillustrated, but the pixel electrode PE may be located between thesecond insulating layer 12 and the third insulating layer 13 and thecommon electrode CE may be located between the third insulating layer 13and the first alignment film AL1. In such a case, the pixel electrode PEis formed into a plate shape without a slit, and the common electrode CEis formed to comprise a slit which opposes the pixel electrodes PE.Alternatively, both of the pixel electrode PE and the common electrodeCE may be each formed into a comb teeth shape and arranged to engagewith each other in gear.

The second substrate SUB2 comprises a second base member 20,light-shielding layers BM, color filters CF, an overcoat layer OC, asecond alignment film AL2, etc.

The light-shielding layers BM and the color filters CF are located inthe surface 20A of the second base member 20. The light-shielding layersBM partition the pixels from each other and are located directly abovethe signal lines S, respectively. The color filters CF oppose the pixelelectrodes PE and partially overlap the respective light-shieldinglayers BM. The color filter CF includes a red color filter, a greencolor filter, a blue color filter and the like. The overcoat layer OCcovers the color filter CF. The second alignment film AL2 covers theovercoat layer OC.

The color filter CF may be disposed on the first substrate SUB1. Thecolor filter CF may include color filters of four or more colors. On apixel to display a white color, a white color filter or an uncoloredresin material may be disposed or the overcoat layer OC may be disposedwithout disposing the color filter.

The detection electrode Rx is located on the surface 20B of the secondbase member 20. The detection electrodes Rx may be formed from aconductive layer containing a metal or a transparent conductive materialsuch as ITO or IZO, or formed by depositing a transparent conductivelayer on a conductive layer containing a metal, or formed of aconductive organic material or a dispersing element of a fine conductivematerial or the like.

A first optical element OD1 including a first polarizer PL1 is locatedbetween the first base member 10 and an illumination device BL. A secondoptical element OD2 including a second polarizer PL2 is located on thedetection electrodes Rx. Each of the first optical element OD1 and thesecond optical element OD2 may include a retardation film as needed.

The scanning lines, the signal lines S and the metal layers M are eachformed from a metal material such as molybdenum, tungsten, titanium oraluminum and may be formed in a single- or multi-layer structure. Forexample, the scanning lines are formed of a metal material containingmolybdenum and tungsten, the signal lines S are formed of a metalmaterial containing titanium and aluminum, and the metal layer M isformed of a metal material containing molybdenum and aluminum. Thecommon electrodes CE and the pixel electrodes PE are each formed of atransparent conductive material such as ITO or IZO. The first insulatinglayer 11 and the third insulating layer 13 are inorganic insulatinglayers while the second insulating layer 12 is an organic insulatinglayer.

Next, a configuration example of the sensor SS built in the displaydevice DSP of this embodiment will be explained. The sensor SS explainedbelow is, for example, a capacitive sensor of a mutual-capacitive type,which detects contact or approach of an object, based on the variationin electrostatic capacitance between a pair of electrodes opposing via adielectric.

FIG. 14 is a plan view showing a configuration example of the sensor SS.

In the configuration example illustrated, the sensor SS comprises sensordrive electrodes Tx and detection electrodes Rx. In the exampleillustrated, the sensor drive electrodes Tx correspond to portionshatched by lines downwardly slanting to the right and are provided onthe first substrate SUB1. The detection electrodes Rx correspond toportions hatched by lines upwardly slanting to the right and areprovided on the second substrate SUB2. The drive electrodes Tx and thedetection electrodes Rx cross each other in the X-Y plane. The detectionelectrodes Rx oppose the sensor drive electrodes Tx along the thirddirection Z.

The sensor drive electrodes Tx and the detection electrodes Rx arelocated in the display area DA and some of the electrodes extend out tothe non-display area NDA. In the example illustrated, the driveelectrodes Tx are each formed into a strip shape extending along thesecond direction Y and arranged along the first direction X to be spacedfrom each other. The detection electrodes Rx each extend along the firstdirection X and are arranged along the second direction Y to be spacedfrom each other. As explained with reference to FIG. 11, the detectionelectrodes Rx are connected to the first terminal provided on the firstsubstrate SUB1 and electrically connected to the detection circuit RCvia the wiring lines. Each of the sensor drive electrodes Tx iselectrically connected to the common electrode drive circuit CD via awiring line WR. The number, size and shape of the sensor driveelectrodes Tx and the detection electrodes Rx are not particularlylimited but can be variously changed.

The sensor drive electrodes Tx each function also as the above-describedcommon electrode CE. In other words, they have a function of generatingan electric field between themselves and the respective pixel electrodePE, and also a function of detecting the position of the object bygenerating the capacitance between themselves and the respectivedetection electrode Rx.

The common electrode driving circuit CD supplies common drive signals tothe drive electrodes Tx including the common electrode CE at the displaydriving time to display images on the display area DA. Further, thecommon electrode drive circuit CD supplies sensor drive signals to thesensor drive electrodes Tx at the sensing driving time to executesensing. The detection electrodes Rx generate electrostatic capacitancebetween the sensor drive electrodes Tx and themselves in accordance withsupply of the sensor drive signals to the sensor drive electrodes Tx.The electrostatic capacitance varies as an object to be detected such asa finger approaches. From the detection electrodes Rx, the detectionsignals based on the electrostatic capacitance are output. The detectionsignals output from the detection electrodes Rx are input to thedetection circuit RC shown in FIG. 11.

The sensor SS in each of the above-explained configuration examples isnot limited to the sensor of the mutual-capacitive type which detectsobjects based the variation in electrostatic capacitance between a pairof electrodes (in the above case, the electrostatic capacitance betweenthe sensor drive electrodes Tx and the detection electrodes Rx), but maybe a self-capacitive type which detects objects based on the variationin electrostatic capacitance between the detection electrodes Rx.

In the example illustrated, the sensor drive electrodes Tx each extendalong the second direction Y and arranged along the first direction Xwith a gap between each adjacent pair, but the sensor drive electrodesTx may each extend along the first direction X and arranged along thesecond direction Y with a gap between each adjacent pair. In this case,the detection electrodes Rx each extend along the second direction Y andare arranged along the first direction X with a gap between eachadjacent pair.

FIG. 15 is a cross section of the display panel taken along a line A-Bshown in FIG. 11, which includes a contact hole V1. Here, only mainparts necessary for the explanation are shown, and the first and secondalignment films and the like are omitted from the illustration. Further,the structure shown in FIG. 16 is a specific example of that shown inFIG. 1, and explanation of the members overlapping those of FIG. 1 willbe omitted.

The first insulating layer 11 comprises an insulating layer 111, aninsulating layer 112 and an insulating layer 113. The insulating layer111, the insulating layer 112, and the insulating layer 113 are stackedin this order on the first base member 10. The first insulating layer 11comprises a concavity GR. In the example illustrated, the concavity GRpenetrates the insulating layers 112 and 113 to the insulating layer111. Although will not be explained in detail, the semiconductor layerof the switching element is disposed between the insulating layer 111and the insulating layer 112 in the display area, and the scanning linesG shown in FIG. 12 are disposed between the insulating layer 112 and theinsulating layer 113.

In the example illustrated, the wiring line W1 is disposed inside theconcavity GR. That is, the wiring line W1 is in contact with theinsulating film 111. The signal line S is located on the firstinsulating layer 11. Here, the wiring line W1 may be disposed on theinsulating film 113, for example, is located in the same layer as thatof the signal line S. The wiring line W1 is formed together with, forexample, the signal line S at once from the same material. The secondinsulating film 12 covers the wiring line W1 and the signal line S, andis arranged also on the insulating film 113. The first terminal TM11 islocated between the second insulating film 12 and the sealing materialSE. The first terminal TM11 is electrically connected with the wiringline W1 via a contact hole CH which penetrates the second insulatingfilm 12 to the wiring line W1. In this embodiment, the first terminalTM1 is formed together with the common electrode CE or the pixelelectrode PE shown in FIG. 13 at once from the same material. Or thefirst terminal TM1 may be formed by stacking a layer formed togetherwith the common electrode CE at once from the same material and a layerformed together with the pixel electrode PE at once from the samematerial. The third insulating film 13 is disposed on the secondinsulating film 12.

Note that in the position which overlaps the concavity GR, theinsulating film 111 may penetrate even to the first base member 10, andthe wiring line W1 disposed inside the concavity GR may be in contactwith the first base member 10.

The light-shielding layer BM is located in the surface 20A. The overcoatlayer OC covers the light-shielding layer BM. The sealing material SE islocated between the first substrate SUB1 and the second substrate SUB2.The liquid crystal layer LC is located in the region surrounded by thefirst substrate SUB1, the second substrate SUB2 and the sealing materialSE.

Although will not be illustrated, the first alignment film may beprovided on a sealing material SE side of the first substrate SUB1.Further, the second alignment film may be provided on a sealing materialSE side of the second substrate SUB2.

Here, the hole VA penetrates the second terminal TM21 and the secondbase member 20. The hole VB penetrates the light-shielding layer BM, theovercoat layer OC and the sealing material SE. The hole VC penetratesthe first terminal TM11, the second insulating film 12, the wiring lineW1 and the first insulating film 11. Further, the first base member 10comprises a concavity CC. The connecting material C is provided on theinner surface of each of the through-holes VA, VB, VC and the concavityCC.

A hollow section of the contact hole V1 is filled with the fillingmaterial FI. Further, the filling material FI is disposed also on thesecond terminal TM2.

In the example illustrated, the first terminal TM11 projects out in thecontact hole V1. With this structure, the contact area between the firstterminal TM11 and the connecting material C can be increased in thecontact hole V1. Thus, it is possible to improve the reliability of theconduction between the connecting material C and the wiring line W1 viathe first terminal TM11.

Next, an example of the method of manufacturing the display device DSPdescribed above will be described with reference to FIGS. 16 to 20.

FIGS. 16 to 20 are diagrams showing the method of manufacturing thedisplay device DSP of the embodiment.

First, as shown in FIGS. 16 and 17, the display panel PNL is prepared.FIG. 16 is a plan view showing an example of the detection electrode Rxand the second terminal TM2. In the example shown in FIG. 16, thedetection electrode Rx is formed from meshed metal thin wires MS. Aninspection pad TPD is connected to the detection electrode Rx via aconnection wiring line CW1. The second terminal TM2 is formed bystacking a metal layer and an oxide layer one on another as shown inFIG. 2. Here, the metal layer is formed from, for example, the samematerial as that of the detection electrode Rx. Further, the secondterminal TM2 may be entirely an oxide electrode as shown in FIG. 4. Thesecond terminal TM2 comprises a circular hole HL formed therein.

Note that the shape of the detection electrode Rx is not limited to thatillustrated in the example, but may be, for example, wavy, or some othershape such as sawtooth or sine wave.

FIG. 17 shows a cross section of the display panel PNL shown in FIG. 16.In the display panel PNL illustrated, the first substrate SUB1 comprisesa first terminal TM1 disposed on the surface 10A side, and the secondsubstrate SUB2 comprises a second terminal TM2 arranged on the surface20B side. The first terminal TM1 comprises a first oxide electrode OX1and a second oxide electrode OX2 as in the example shown in FIG. 6. Thesecond terminal TM2 comprises a metal layer MT and an oxide electrode OXas in the example shown in FIG. 2. Further, the second terminal TM2comprises a hole HL. The protection material PT covers the secondterminal TM2, and is brought into contact with the surface 20B in thehole HL.

Subsequently, as shown in FIG. 18, laser beam LL1 is irradiated fromabove the second substrate SUB2. With the irradiation of the laser beamLL1, the protection material PT in the hole HL is removed. At the sametime, the portion of the protection material PT which is located on thesecond terminal TM2 around the hole HL is also removed. That is, a partof the upper surface of the second terminal TM2 is exposed.

Then, as shown in FIG. 19, laser beam LL2 is irradiated from above thesecond substrate SUB2. As the laser beam source, for example, a carbondioxide gas laser is applicable, but various devices, as long as beingable to drill a hole in a glass material or organic material, may beused as well, including an excimer laser device. With the irradiation ofthe laser beam LL2 in such a manner, the contact hole V for connectingthe first terminal TM1 and the second terminal TM2 is formed.

Note that in the step shown in FIG. 19, a part of the upper surface ofthe second terminal TM2 is exposed, but the second terminal TM2 includesthe oxide electrode OX as its top layer, and therefore, it cannot beoxidized easily. Thus, it is possible to suppress the increase in theresistance of the second terminal TM2.

Next, as shown in FIG. 20, the connecting material C which electricallyconnects the first terminal TM1 and the second terminal TM2 to eachother is formed. More specifically, first, the display panel PNL isplaced in a chamber, and the air in the chamber is discharged. Then, aconductive material CM is injected to the contact hole V in a vacuum(under an environment of pressure lower than atmospheric pressure).Thereafter, a gas such as air or inert gas is introduced to the chamberto lower the degree of vacuum, which causes the conductive material CMto flow into the holes VB, VC and the concavity CC from the hole VA andto be brought into contact with the first terminal TM1. Then, as thesolvent contained in the conductive material CM evaporates, the volumeof the conductive material CM decreases. As a result, fine particles ofthe metal material in the conductive material CM remain as a coat on theinner surface of the contact hole V, and a hollow portion is formed inthe contact hole V. The connecting material C is brought into contactwith each of the second terminal TM2 and the second base member 20 inthe hole VA. Further, it is also brought into contact with each of thelight-shielding layer BM, the overcoat layer OC and the sealing materialSE in the hole VB, with each of the first terminal TM1, the firstinterlayer insulating film IT1 and the second interlayer insulating filmIT2 in the hole VC, and also with the first base member 10 in theconcavity CC.

Note that the method of forming the connecting material C described withreference to FIG. 20 is only an example and is not limited to this. Forexample, the connecting material C similar to that described above canbe formed by such a technique that the connecting material C is injectedto the hole VA under atmospheric pressure, and then the solventcontained in the connecting material C is removed.

Next, another example of the method of manufacturing the display deviceDSP described above will be described with reference to FIGS. 21 to 23.

FIGS. 21 to 23 are diagrams showing another example of theabove-described method of manufacturing the display device DSP of theembodiment.

First, as shown in FIG. 21, the display panel PNL is prepared. Thestructure shown in FIG. 21 is different from that FIG. 17 in that theprotection material PT is not formed in the non-display area NDA.

Subsequently, as shown in FIG. 22, laser beam LL2 is irradiated fromabove the second substrate SUB2, and thus the contact hole V is formed.

Then, as shown in FIG. 23, the connecting material C is formed. Here,the connecting material C is formed in a similar manner to that of themanufacturing method shown in FIG. 20.

Note that in the steps shown in FIGS. 21 to 23, the upper surface of thesecond terminal TM2 is exposed in the non-display area NDA, but thesecond terminal TM2 includes the oxide electrode OX as its top layer,and therefore, it cannot be oxidized easily. Thus, it is possible tosuppress the increase in the resistance of the second terminal TM2.

Further, in the steps shown in FIGS. 21 to 23, the protection materialPT is not disposed on the non-display area NDA, the step of removing theprotection material PT by laser beam, as shown in FIG. 18 can beomitted.

FIG. 24 is a plan view showing another configuration example of thedisplay device DSP of this embodiment. The structure shown in FIG. 24 isdifferent from that FIG. 11 in that the detection electrodes Rx1, Rx2,Rx3, . . . , each extend along the second direction Y and are arrangedalong the first direction X with a gap between each adjacent pair.

In the example illustrated, the detector RS extends in the seconddirection Y in the display area DA. The second terminals TM21, TM22,TM23, . . . , are arranged along the first direction X with a gapbetween each adjacent pair between the display area DA and the wiringboard SUB3. The contact holes V1, V2, V3, . . . , are arranged along thefirst direction X with a gap between each adjacent pair. Although notillustrated, the display device DSP may comprise sensor drive electrodesextending in the first direction X and arranged along the seconddirection Y with a gap between each adjacent pair.

The configuration example shown in FIG. 24 is applicable to aself-capacitive type sensor SS which utilizes the detection electrodesRx, and also applicable to mutual-capacitive type sensor SS whichutilizes the sensor drive electrode (not illustrated) and the detectionelectrodes Rx.

As described above, according to this embodiment, a display device witha frame whose width is reducible can be obtained.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A display device comprising: a first substratecomprising a first base member and a first terminal; a second substratecomprising a second base member comprising a first surface opposing andspaced apart from the first terminal and a second surface on an oppositeside to the first surface, a second terminal located on a side of thesecond surface, and a first hole which penetrates from the first surfaceto the second surface and the second terminal; a liquid crystal layerdisposed between the first substrate and the second substrate; anorganic insulating layer located between the first terminal and thesecond base member and comprising a second hole connecting to the firsthole; and a connecting material provided on the first hole toelectrically connect the first terminal and the second terminal to eachother, wherein the organic insulating layer includes a sealant whichattaches the first substrate and the second substrate and surrounds theliquid crystal layer, a diameter of the second hole is greater than adiameter of the first hole, and at least one of the first terminal andthe second terminal including an oxide electrode in contact with theconnecting material.
 2. The device of claim 1, wherein the secondterminal is an oxide electrode in contact with the second surface. 3.The device of claim 2, further comprising: a detection electrode locatedon the second surface and connected to the second terminal, wherein athickness of the second terminal is greater than a thickness of thedetection electrode.
 4. The device of claim 1, wherein the secondterminal comprises a metal layer in contact with the second surface andan oxide electrode in contact with the metal layer.
 5. The device ofclaim 1, further comprising: a protection material covering the secondterminal.
 6. The device of claim 1, further comprising: a firstinterlayer insulating layer located between the first base member andthe first terminal, wherein the first terminal comprises a first oxideelectrode located on the first interlayer insulating layer.
 7. Thedevice of claim 6, wherein the first terminal comprises a second oxideelectrode above the first oxide electrode.
 8. The device of claim 7,further comprising: a second interlayer insulating layer between thefirst oxide electrode and the second oxide electrode.
 9. The device ofclaim 7, wherein the second oxide electrode is in contact with the firstoxide electrode.
 10. The device of claim 7, further comprising: a metalwiring line on the first interlayer insulating layer so as to beconnected to the first oxide electrode.
 11. The device of claim 1,wherein the first substrate comprising a third hole which penetrates thefirst terminal.
 12. A display device comprising: a first substratecomprising a first base member, a first terminal and a first interlayerinsulating layer located between the first base member and the firstterminal; a second substrate comprising a second base member comprisinga first surface opposing and spaced apart from the first terminal and asecond surface on an opposite side to the first surface, a secondterminal located on a side of the second surface, and a first hole whichpenetrates from the first surface to the second surface and the secondterminal; a liquid crystal layer disposed between the first substrateand the second substrate; an organic insulating layer located betweenthe first terminal and the second base member and comprising a secondhole connecting to the first hole; and a connecting material provided onthe first hole to electrically connect the first terminal and the secondterminal to each other, wherein the organic insulating layer includes asealant which attaches the first substrate and the second substrate andsurrounds the liquid crystal layer, a diameter of the second hole isgreater than a diameter of the first hole, and the first terminalcomprising a first oxide electrode located on the first interlayerinsulating layer, a second oxide electrode located above the first oxideelectrode, and a second interlayer insulating layer located between thefirst oxide electrode and the second oxide electrode, the secondterminal comprising a metal layer in contact with the second surface anda third oxide electrode in contact with the metal layer, and the firstoxide electrode, the second oxide electrode, and the third oxideelectrode are in contact with the connecting material.
 13. The device ofclaim 12, wherein the first substrate comprising a third hole whichpenetrates the first terminal.
 14. An inter-substrate conductingstructure comprising: a first substrate comprising a first base memberand a first terminal; a second substrate comprising a second base membercomprising a first surface opposing and spaced apart from the firstterminal and a second surface on an opposite side to the first surface,a second terminal located on a side of the second surface, and a firsthole which penetrates from the first surface to the second surface andthe second terminal; a liquid crystal layer disposed between the firstsubstrate and the second substrate; an organic insulating layer locatedbetween the first terminal and the second base member and comprising asecond hole connecting to the first hole; and a connecting materialprovided on the first hole to electrically connect the first terminaland the second terminal to each other, wherein the organic insulatinglayer includes a sealant which attaches the first substrate and thesecond substrate and surrounds the liquid crystal layer, a diameter ofthe second hole is greater than a diameter of the first hole, and atleast one of the first terminal and the second terminal including anoxide electrode in contact with the connecting material.
 15. Thestructure of claim 14, wherein the second terminal is an oxide electrodein contact with the second surface.
 16. The structure of claim 15,further comprising: a detection electrode located on the second surfaceand connected to the second terminal, wherein a thickness of the secondterminal is greater than a thickness of the detection electrode.
 17. Thestructure of claim 14, wherein the second terminal comprises a metallayer in contact with the second surface and an oxide electrode incontact with the metal layer.
 18. The structure of claim 14, furthercomprising: a protection material covering the second terminal.
 19. Thestructure of claim 14, further comprising: a first interlayer insulatinglayer located between the first base member and the first terminal,wherein the first terminal comprises a first oxide electrode located onthe first interlayer insulating layer.
 20. The structure of claim 19,wherein the first terminal comprises a second oxide electrode above thefirst oxide electrode.
 21. The structure of claim 20, furthercomprising: a second interlayer insulating layer between the first oxideelectrode and the second oxide electrode.
 22. The structure of claim 20,wherein the second oxide electrode is in contact with the first oxideelectrode.
 23. The structure of claim 14, wherein the first substratecomprising a third hole which penetrates the first terminal.